日月光表示，VIPack先進封裝解決方案，是一個根據產業藍圖強化協同合作之可擴展的創新平台，為客戶提供解方案的產品也已上市。
日月光指出，走入以數據為中心的時代，隨著人工智能(AI)、機器學習(ML)、5G通信、高效能運算(HPC)、物聯網(IoT)和汽車應用數據的增長，半導體市場正呈指數級增長。對創新封裝和IC協同設計、尖端晶圓級製造製程、精密封裝技術以及全面的產品與測試解決方案的需求同步增長。
為因應各種應用都要求解決方案在滿足嚴格的成本條件，實現更高性能、更強功能及更佳功耗，封裝愈顯重要。
日月光表示，隨著小芯片(chiplet)設計日趨主流，進一步提升將多個晶片整合到單個封裝內的需求。VIPack是以3D異質整合為關鍵技術的先進互連技術解決方案，建立完整的協同合作平台。
日月光VIPack由六大核心封裝技術组成，透過全面性整合的生態系統協同合作，包括日月光基於高密度RDL的FanOut Package-on-Package (FOPoP)、Fan Out Chip-on-Substrate (FOCoS)、Fan Out Chip-on-Substrate-Bridge (FOCoS-Bridge) 和 Fan Out System-in-Package (FOSiP)，以及基於矽通孔 (TSV) 的 2.5D/3D IC 和 Co-Packaged Optics。
這個先進封裝平台，除了提供可優化時脈速度、頻寬和電力傳輸的高度整合矽封裝解決方案所需的製程能力，更可縮短共同設計時間、產品開發和上市時程。VIPack™ 平台提供了必要的功能，可實現開拓性的高度集成矽封裝解決方案，以優化時鐘速度、帶寬和功率傳輸，並縮短協同設計時間、產品開發和上市時間。 ASE 技術營銷和推廣高級總監 Mark Gerber 評論說：“雙面 RDL 等關鍵性的新創新促成了一系列新的垂直集成封裝技術支柱，這些支柱構成了我們 VIPack 平台的支柱。”
日月光技術行銷及推廣資深處長Mark Gerber表示，雙面 RDL 互連線路等關鍵創新技術衍生一系列新的垂直整合封裝技術，為VIPack 平台創建堅實的基礎。”
VIPack平台提供應用於先進的高效能運算(HPC)、人工智能(AI)、機器學習(ML)和網絡等應用的整合分散式SoC（系統單晶片）和HBM（高帶寬記憶體）互連所需的高密度水平和垂直互連解決方案。高速網絡也面臨將多個複雜組件整合成光學封裝的挑戰，VIPack創新解決方案可將這些組件整合在一個垂直結構中，優化空間和性能。
日月光表示，VIPack應用可通過超薄型系統級封裝模組(SiP module)進一步延伸至手機市場，解決常見的射頻疊代設計流程問題，並通過整合在RDL層中的被動元件達到更高效能。此外，下一代應用處理器可滿足對小尺寸設計(lower profile)封裝解決方案的需求，同時解決先進晶圓節點的電源傳輸問題。
“ASE 很高興將其 VIPack™ 平台推向市場，為我們的客戶從設計過程一直到生產進行創新開闢了新的機會，並在功能、性能和成本方面獲得了廣泛的收益，”博士說。 CP日月光研發副總裁洪先生。 “作為全球領先的 OSAT，ASE 的戰略定位是幫助客戶提高效率、加快上市時間並保持盈利增長。 VIPack™ 強調了我們提供迄今為止最具創新性的包裝技術的承諾。”
“我們不斷擴大的數字化世界正在推動整個半導體行業無與倫比的創新，而 VIPack™ 代表了轉型封裝技術的重要飛躍，這是實現客戶保持競爭力所需的高度複雜系統集成所需的封裝技術，”Yin Chang 高級副總裁說銷售和營銷。 “通過 VIPack™，我們使我們的客戶能夠在其半導體設計和製造過程中發現新的效率，並重新構想實現卓越應用所需的集成技術。”
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE:ASX, TAIEX: 3711), today introduced VIPack™, an advanced packaging platform designed to enable vertically integrated package solutions. VIPack™ represents ASE’s next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.
As our world navigates the data centric era, the semiconductor market is growing exponentially, with the growth behind the data coming from devices used across Artificial Intelligence (AI), Machine Learning (ML), 5G Communications, High Performance Computing (HPC), Internet-of-Things (IoT), and Automotive applications. Demand for innovative package and IC co-design, cutting-edge wafer level fabrication processes, sophisticated packaging technologies, and comprehensive product and testing solutions has never been greater. The role of packaging has become increasingly critical, as applications call for solutions to enable higher performance, greater functionality, and improved power, while meeting stringent cost parameters. The rising adoption of chiplet-based co-designs is further fueling demand for multi-chip integration into a single package. The launch of VIPack™ firmly establishes a collaborative platform for exceptional interconnect solutions where 3D heterogeneous integration has become critical.
ASE’s VIPack™ is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem. These include ASE’s high density RDL-based Fanout Package-on Package (FOPoP), Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP) as well as Through Silicon Via (TSV)-based 2.5D and 3D IC and Co-Packaged Optics processing capabilities. The VIPack™ platform provides the capabilities necessary to enable trailblazing highly integrated silicon packaging solutions required to optimize clock speed, bandwidth, and power delivery, and to reduce co-design time, product development, and time to market. “Critical new innovations such as double-sided RDL have allowed a series of new vertically integrated package technology pillars that create the backbone of our VIPack platform,” commented Mark Gerber, Sr. Director of Technical Marketing and Promotion at ASE.
The VIPack™ platform delivers the dense horizontal and vertical interconnect solutions required to interconnect disaggregated SoCs (System-on-Chip) and HBM (High Bandwidth Memory) used for leading-edge HPC, AI, ML, and Network applications. High-speed networking is also being challenged with several complex components for optical packaging that require VIPack™ innovation to bring these components together in a vertical structure for both space and performance enablement. Applications supported by VIPack™ further extend to the mobile market with ultra-low profile SIP modules to address the common RF iterative design process and enable a higher level of performance with integrated passives in the RDL layers. Additionally, the next generation of application processors address the demand for lower profile package solutions, while solving power delivery issues for advanced silicon nodes.
“ASE is delighted to bring its VIPack™ platform to market, opening up new opportunities for our customers to innovate from the design process all the way to production and to reap extensive benefits in relation to functionality, performance, and cost,” said Dr. C.P. Hung, Vice President of R&D, ASE. “As the world’s leading OSAT, ASE is strategically positioned to help customers improve efficiency, speed time-to-market, and sustain profitable growth. VIPack™ underscores our commitment to deliver our most innovative packaging technologies to date.”
“Our expanding digitized world is driving unparalleled innovation across the semiconductor industry and VIPack™ represents a crucial leap forward in the transformational packaging technologies required to achieve the highly complex system integration our customers need to remain competitive,” said Yin Chang, Senior Vice President of Sales and Marketing. “Through VIPack™, we’re empowering our customers to discover new efficiencies in their semiconductor design and manufacturing process and to reimagine the integration technologies required to accomplish application excellence.”
from : https://www.aseglobal.com/press-room/vipack/
ASE introduces VIPack™ to help transform packaging solution enablement
關鍵字 KEYWORD #日月光,VIPack, ASE,Advanced Semiconductor Engineering